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TAU-9000/9000HR High-Resolution Epitaxial Wafer Minority Carrier Lifetime Imaging Tools
TAU-9000/9000HR High-Resolution Epitaxial Wafer Minority Carrier Lifetime Imaging Tools
TAU-9000/9000HR High-Resolution SiC Wafer Minority Carrier Lifetime Imaging Tools uses time-resolved spectroscopic imaging to characterize SiC substrates and epitaxial wafers. It supports material qualification, production inspection, and R&D, providing measurement data for quality control, process optimization, and defect analysis.

These tools support both full-wafer mapping and localized microscopic imaging. In full-wafer mode, it achieves a spatial resolution of 100 μm to characterize minority carrier lifetime distributions and uniformity. It accommodates 6-, 8-, and 12-inch wafers, with measurement times of less than 10 minutes per 6-inch wafer. In microscopic mode, spatial resolution reaches 0.9 μm, enabling visualization of lifetime variations associated with threading dislocations and stacking faults. A temporal resolution of <2 ns enables characterization of both short-lifetime substrates and epitaxial layers.

Switchable 355 nm and 266 nm excitation enables independent extraction and mapping of bulk minority carrier lifetime and surface recombination velocity. These tools support fully automated measurements, with optional nitrogen-purged or vacuum sample chambers to minimize environmental interference and preserve sample surface conditions. An optional temperature-control module spanning room temperature to 200°C enables temperature-dependent lifetime measurements for investigating carrier recombination mechanisms and trap-state characteristics.
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Key Features

  • High throughput: 5-10 min/wafer

  • High temporal resolution: <2 ns

  • High spatial resolution: ~275 μm (Full wafer mode);~0.9 μm (High resolution mode)


Specifications

Material

SiC substrate and epitaxial layer

Wafer Sizes

6", 8" and 12"

Inspection Throughput

5-10 min/wafer

Temporal Resolution

<2 ns

Spatial Resolution

~275 μm (Full wafer mode); ~0.9 μm (High resolution mode)

Excitation Wavelength

355 nm / 266 nm (for bulk and surface inspection)

Lifetime Measurement Range

20 ns-10 ms

Compatible with epi-layers of different thicknesses undisturbed by substrate


Case Examples

Available Information

Equipment Highlights

① Local Imaging of Epitaxial Wafers at 0.9 μm Spatial Resolution

Local Imaging of Epitaxial Wafers at 0.9 μm Spatial Resolution

High-resolution imaging mode allows direct visualization of defects including TD and SF, and direct extraction of their minority carrier lifetimes. The minority carrier lifetime in SF areas is shorter than that in normal areas.

② Minority Carrier Lifetime Distribution Imaging for Typical Epitaxial Wafers of Different Thicknesses

Minority Carrier Lifetime Distribution Imaging for Typical Epitaxial Wafers of Different Thicknesses

Compatible with inspection requirements for epitaxial wafers of varying thicknesses, a single system covers diverse process scenarios from R&D to mass production. It helps customers establish unified quality evaluation standards, reduce equipment investment, and improve R&D and production efficiency.

③ Supports Substrate Minority Carrier Lifetime Imaging

Substrate Minority Carrier Lifetime Imaging

Our equipment enables substrate minority carrier lifetime measurement, thereby supporting material quality assessment, process optimization, and yield improvement.

④ Resolving Bulk and Surface Carrier Lifetime for Thick Epi-Layers via 355 nm and 266 nm Excitations

Bulk and Surface Carrier Lifetime Analysis

By decoupling lifetime mappings acquired at 266 nm and 355 nm, the system provides separated images of bulk minority carrier lifetime and surface recombination velocity, offering deeper insights into material quality assessment.

⑤ Minority Carrier Lifetime Measurements at Different Temperatures

Minority Carrier Lifetime Measurements at Different Temperatures

Compared with room temperature, the minority carrier lifetime becomes longer at 175 °C, and its distribution also changes.

By delivering innovative, reliable, and scalable solutions, we empower industries to achieve unparalleled precision and efficiency, driving progress in research and manufacturing worldwide.
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