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| TPL300-UV combines time-spectral-spatial resolution via research-grade upright microscope and precision XY stage. Enables automated fluorescence lifetime imaging, SHG/Raman mapping, and UV-excited measurements down to 200nm detection/206nm excitation. | |||||||||
Products Feature
High-resolution Imaging: ≤20ps/≤1μm resolution for defect detection in semiconductor wafers.
Multi-excitation: 206/257/343/515nm wavelengths.
Non-destructive: Enables wafer quality control without sample damage.
Expandable: Supports Raman/SHG/photocurrent imaging modules.
Specifications
Typical parameters
| Fluorescence lifetime testing wavelength | 220-600 nm |
| Fluorescence spectroscopy testing wavelength | 200-1000 nm |
| Time resolution | ≤20 ps |
| Spatial resolution | ≤1 μs |
| Imaging capabilities | Fluorescence intensity or spectral imaging/Fluorescence lifetime imaging/DUV imaging |
| Imaging range | Customizable |
| Excitation wavelengths | 206 nm/257 nm/343 nm/515 nm |
Expansion capabilities
| Expansion modules | Raman, second harmonic generation (SHG), photocurrent, and other imaging modules. |
| Customer requirements | Supporting expansion to external conditions such as Cryostat, diamond anvil cell, magnetic fields, etc. |
Application
