Deep Ultraviolet (DUV) Fluorescence System

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TPL300-UV combines time-spectral-spatial resolution via research-grade upright microscope and precision XY stage. Enables automated fluorescence lifetime imaging, SHG/Raman mapping, and UV-excited measurements down to 200nm detection/206nm excitation.
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Products Feature

Specifications

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Products Feature

High-resolution Imaging: ≤20ps/≤1μm resolution for defect detection in semiconductor wafers.
Multi-excitation: 206/257/343/515nm wavelengths.
Non-destructive: Enables wafer quality control without sample damage.
Expandable: Supports Raman/SHG/photocurrent imaging modules.

Specifications

Typical parameters

Fluorescence lifetime testing wavelength	220-600 nm
Fluorescence spectroscopy testing wavelength	200-1000 nm
Time resolution	≤20 ps
Spatial resolution	≤1 μs
Imaging capabilities	Fluorescence intensity or spectral imaging/Fluorescence lifetime imaging/DUV imaging
Imaging range	Customizable
Excitation wavelengths	206 nm/257 nm/343 nm/515 nm

Expansion capabilities

Expansion modules	Raman, second harmonic generation (SHG), photocurrent, and other imaging modules.
Customer requirements	Supporting expansion to external conditions such as Cryostat, diamond anvil cell, magnetic fields, etc.

Application

Product Catalog of TTS-2025.pdf

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