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| Precise and isolate identification of TSD/TED/BPD/SF in one scan Single processing chuck for any thickness and size (4-10”) Optical non-destructive methodology High contrast, high resolution imaging Advanced review and annotation software Inspection Speed: 17min/6”wafer (avg.) | |||||||||
Precise and isolate identification of TSD/TED/BPD/SF in one scan
Single processing chuck for any thickness and size (4-10”)
Optical non-destructive methodology
High contrast, high resolution imaging
Advanced review and annotation software
Inspection Speed: 17min/6”wafer (avg.)
